LCM Display

LCM Display

(7)

AGG128128D

COG (Chip on glass).COG(Chip On Glass)  is one of the main structures of LCD module, consisting of LCD, IC, FPC, backlight, etc.  IC is bonded on LCD glass through COG Bonding technology. The whole structure is simple & flexible and performance cost ratio is high.

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ABG240128S

Chip On Board LED refers to a variety of surface mount and chip-on-board LED. By breaking through the limitation of chips array to achieve pixel pitch below 0.1mm, COB technology has been one of the most cutting edge LED technologies in the LED industry. It is accelerating the breakthrough process to reach the future of LED displays -- Micro LED.

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ABG128064A

COB LED is a new light source that combines the advantages of other LED chip types, such as high-brightness, low power consumption and good color consistency. It is characterized by pixel pitch below 0.1mm, small size and low cost.

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ABC020004G

COB LED is a kind of chip mounted on PCB assembly with light output. The technology aims at breaking the limitation of chips array to achieve pixel pitch below PH0.Xmm. It is accelerating breakthrough process to reach the future of LED displays -- Micro LED.

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AGC016002A

COG (Chip on glass).COG(Chip On Glass)  is one of the main structures of LCD module, consisting of LCD, IC, FPC, backlight, etc.  IC is bonded on LCD glass through COG Bonding technology. The whole structure is simple & flexible and performance cost ratio is high.

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ABC016002E

COB LED are categorized as front-mounted chip, flip chip, and semi-flip chip. By breaking through limitation of chips array to achieve pixel pitch below PH0.Xmm, COB technology has been one of the most cutting-edge LED technologies in the LED industry. And it is accelerating the breakthrough process to reach the future of LED displays -- Micro LED.

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AGG128064A

COG (Chip on glass).COG(Chip On Glass)  is one of the main structures of LCD module, consisting of LCD, IC, FPC, backlight, etc.  IC is bonded on LCD glass through COG Bonding technology. The whole structure is simple & flexible and performance cost ratio is high.

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